電視/顯示器
Mini LED 分區調光直下式背光
行家光電啟用下一代全屏幕和窄光學距離（OD 5mm）之背光設計，以數千顆 mini LED 作為背光源，採用多區亮度控制和廣色域量子點技術，實現更高的對比度（1,000,000 :1) 和更生動的色彩表現（REC. 2020 >95%），可與 OLED 顯示器相媲美，甚至超越OLED的顏色表現。此外，可以實現更高的亮度（>1000 nits），而不會出現OLED常見的圖像烙屏和壽命問題。
Mini LED Light Source & Backlight Panel
Mini LED Light Source: mNCSP1212
- Blue / White light
- NCSP size：1.2 x 1.2 mm
- Mini LED Chip size：06 x 20 mil, 10 x 20 mil
- Patented Top Diffusive Lens for large batwing viewing angle : 170°
- Fanout PAD compatible with conventional SMT process
- Excellent overdrive capability for high reliability and cost effectiveness
27″ / 32″ Mini LED Backlight Panel
- Support 1152 local dimming zones
- Curved backlight panel with mNCSP1212 Package-On-Board (POB)
- Support Driver-On-Board (DOB) design
- OD 3 mm with ultra large LED pitch 10 mm
- Backlight brightness >20,000 nits
筆記型電腦
Mini LED 分區調光直下式背光
筆記型電腦需要更薄的 Mini LED 背光。我們使用藍光 Chip-on Board (COB) Mini LED背光板技術，並通過量子點薄膜來實現廣色域，以及藉由分區調光來實現高對比度。
Mini LED背光 Panel
Mini LED背光 Panel
- Blue chip-on-board (COB) backlight panel
- Mini LED Chip size：05 x 09 / 06 x 20 mil
- Panel size：17.3″ / 16″ / 15.6″
- Zero OD (0mm) with large LED pitch 4 mm
- Backlight brightness >17,000 nits
- COB mass transfer technology – 99.99% SMT yield rate
- 250 um planarized encapsulant layer on COB – the uniformity of the encapsulant layer is controlled within +/- 30um
智慧型手錶
Mini LED 分區調光直下式背光
高精度和高速Mini LED巨量轉移打件技術，使Mini LED背光面板技術可於穿戴設備液晶屏幕實現。 Mini LED 顯示屏改善了全彩方案並降低了面板功耗，以提升電池待機時間。
Mini LED Light Source & Backlight Panel
Mini LED Light Source: mCSP0505
- White light
- CSP size：0.5 x 0.5 mm
- Chip size：05 x 09 mil
- Patented Top Diffusive Lens for large batwing viewing angle : 170°
- Excellent overdrive capability for high reliability and cost effectiveness
Mini LED Backlight Panel
- White / Blue chip-on-board (COB) backlight panel
- Panel size：1.2″ ~ 1.7″
- Zero OD (0mm) with large LED pitch 1.5 mm
- Power savings up to 30% with local dimming
- COB mass transfer technology – 99.99% SMT yield rate
- 250 um planarized encapsulant layer on COB – the uniformity of the encapsulant layer is controlled within +/- 30um